As demand shifts for dual-die Blackwell products, Nvidia reportedly increases CoWoS-L orders while possibly reducing orders ...
NVIDIA's demand for advanced packaging from TSMC, but the tech it needs is changing: Jensen Huang says NVIDIA will transition ...
The revised road plan presents the 200 Series, which employs dual-die design produced using CoWoS-L technology. Systems in ...
Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.
During the inauguration ceremony of SPIL on January 16, Nvidia founder and CEO Jensen Huang stated that the Blackwell system ...
Speaking on the sidelines of an event hosted by chip supplier Siliconware Precision Industries in Taichung, Taiwan, Huang explained the transition in Nvidia's chip packaging requirements.
"So it's not about reducing capacity. It's actually increasing capacity into CoWoS-L." Hopper refers to Nvidia's GPU ...
Nvidia's demand for advanced packaging from Taiwan Semiconductor remains strong despite evolving technology; plans to use ...
Shares of Nvidia Corp. (NVDA) rose by more than 1% in pre-market trade on Thursday after CEO Jensen Huang brushed aside ...